1 | Max board size : 24 x 28 inch . | 9 | Min SMD pitch : BONDING |
2 | Layers : Single side ~ 18L . | 10 | Impedance control range : +/- 10% . |
3 | Board thickness range : 0.008 ~ 0.157 inch . | 11 |
Surface finished : HASL,Immersion gold(Au : 2~5u”) , White tin plated , Gold finger(Au : 3~50u”) ,Hard Gold Plated(Au:50u”), Entek(OSP) . |
4 | Min. inner layer thickness : 0.002 inch . | 12 | Buried vias and Blind vias : available .(Laser Drilling) |
5 | Thickness tolerance : + / -10% | 13 | Electric test voltage : AC 150V ~250V. |
6 |
Min finished hole size : 0.006 inch (Thickness: 1.0mm) |
14 | Insulating resistance test : 1 Mega ohm . |
7 | Aspect ratio : 8:1 . | 15 |
Material type : Aluminum Metal Base, Lead Free (RoHS) , Non-Halogens Material, CEM-1, CEM-3, FR-4, ISOLA: FR-402, FR-406, FR-408 |
8 | Min line width/spacing : 0.003/0.003 inch . |